Wang Gungwu Visiting Fellows Programme 2027 in Singapore
Country: SingaporeHost Institution: ISEAS – Yusof Ishak InstituteCategory: FellowshipDuration: 2 to 6 monthsDeadline: Tuesday, 4 August 2026Eligibility: Post-doctoral researchers and mid-career policy makers The Wang Gungwu Visiting Fellows Programme 2027 supports post-doctoral researchers and mid-career policy makers working on big-power relations and their
Bond University Leadership Scholarship Overview
Country: AustraliaHost Institution: Bond UniversityCategory: Undergraduate ScholarshipValue: 25% tuition remissionApplication Dates: 1 May 2026 to 31 August 2026Study Level: Undergraduate The Bond University Leadership Scholarship recognises current Year 12 students with strong leadership experience, community involvement, and academic achievement. The scholarship provides 25%
National Scholarship Programme Slovakia for International Applicants
Country: SlovakiaCategory: ScholarshipProgramme: National Scholarship Programme of the Slovak RepublicFunded by: Ministry of Education, Research, Development and Youth of the Slovak RepublicEligible Applicants: Students, PhD students, university teachers, researchers, and artistsDeadlines: 30 April and 31 October at 16:00 CET The National Scholarship Programme
Stephen Young Global Leaders Scholarship 2026 in Glasgow
Location: GlasgowHost Institution: University of StrathclydeSchool: Strathclyde Business SchoolCategory: ScholarshipValue: Full Scholarship covering tuition and living costsDeadline: 31 May 2026 The Stephen Young Global Leaders Scholarship 2026 supports scholars of exceptional merit who will undertake the Strathclyde MBA or an MSc in Strathclyde
A*STAR Scholarship Portal for Scholarships and Awards
Organization: Agency for Science, Technology and ResearchCategory: Scholarship and Award Application PortalPortal: ASTAR Scholarship PortalUse: Applications for ASTAR scholarships and awards onlyLogin: SingPass for Singapore Citizens and Permanent ResidentsSupport: SINGA, scholarship, and technical enquiry options available The A*STAR Scholarship Portal is the official
SECAI Scholarships for Master’s Students in AI
Country: GermanyCategory: ScholarshipHost Institutions: TU Dresden or Leipzig UniversityStudy Level: Master’s levelFunding: Monthly grant of EUR 934Deadline: 30 June The SECAI Scholarships support outstanding students who plan to study Artificial Intelligence or an AI-related field at TU Dresden or Leipzig University. The scholarships
Ilia Calderón Scholarship 2026 for One Young World Summit
Summit Location: Cape Town, South AfricaCategory: ScholarshipProgram: Ilia Calderón Scholarship 2026Organizer: One Young WorldPartner: Jang Calderón Family FoundationApplication Deadline: 15 June 2026 The Ilia Calderón Scholarship 2026 supports young leaders who are leading innovative and impactful initiatives in Latin America and the Caribbean.
Taiwan Fellowship 2027 for Scholars and Researchers
Location: TaiwanCategory: FellowshipOrganizer: Ministry of Foreign Affairs, Republic of China (Taiwan)Administrator: Center for Chinese Studies, National Central LibraryDuration: 3 to 12 monthsDeadline: 30 June 2026, 23:59 Taiwan time The Taiwan Fellowship 2027 supports foreign experts and scholars who want to conduct advanced research
Radcliffe Fellowship 2027–2028 at Harvard University
Institution: Harvard Radcliffe Institute, Harvard UniversityCategory: FellowshipFellowship Year: 2027–2028Location: Cambridge/Boston areaDeadlines: 10 September 2026 and 1 October 2026, depending on fieldFunding: $78,000 stipend plus $5,000 for project expenses The Radcliffe Fellowship 2027–2028 offers scientists, writers, scholars, public intellectuals, and artists the chance to
Autumn Korean Culture Camp 2026 Scholarship in South Korea
Country: South KoreaCategory: Travel ScholarshipProgram: Autumn Korean Culture Camp 2026Organizer: AYFNScholarship Types: Gold and SilverDeadline: 15 July 2026 The Autumn Korean Culture Camp 2026 scholarship is a paid travel support opportunity by AYFN for selected applicants who want to experience South Korea through
